Q3 2023 Monetary Highlights：
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Income was RMB 8.26 billiona rise of 30.8% quarter-on-quarter
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Web revenue was RMB 0.48 billiona rise of 24% quarter-on-quarter
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Earnings per share was RMB 0.26
Q3 YTD 2023 Monetary Highlights：
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Income was RMB 20.43 billion
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Web revenue was RMB 0.97 billion
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Earnings per share was RMB 0.54
SHANGHAI, Oct. 27, 2023 /PRNewswire/ — At this time, JCET Group (SSE: 600584), a number one international supplier of built-in circuit (IC) back-end manufacturing and know-how providers, introduced its monetary outcomes for the third quarter of 2023. The monetary report exhibits that within the third quarter, JCET achieved income of RMB 8.26 billiona rise of 30.8% quarter-on-quarter, and internet revenue of RMB 0.48 billiona rise of 24% quarter-on-quarter.
JCET has centered on key functions of superior packaging this 12 months, constantly enhancing its general resolution capabilities for utility eventualities, optimizing manufacturing capability structure, and additional strengthening its main place within the international IC packaging and check business.
JCET has achieved modern breakthroughs in markets equivalent to automotive electronics, 5G communications, high-performance computing (HPC), and huge bandgap energy gadgets. Seizing market alternatives pushed by the acceleration of the electrical automobile market, JCET’s automotive electronics enterprise has maintained speedy progress. Within the first three quarters of this 12 months, the corporate’s automotive electronics income elevated by 88% year-on-year. Within the 5G communications-related market, JCET offered international prospects with providers in R&D and HVM, additional solidifying its main place in areas together with Antenna in Package deal (AiP) modules, RF energy amplifiers (PA), and radio frequency entrance finish (RFFE) modules.
Leveraging high-density heterogeneous SiP applied sciences and advantageous international manufacturing layouts, JCET intensifies its efforts with prospects in AI and HPC domains for superior packaging options improvement and product introductions, accelerating market enlargement in high-computation methods, energy administration, high-performance storage, and sensible terminals. Within the energy semiconductor market, the high-density integration options developed by JCET in collaboration with international prospects on huge bandgap energy gadgets are extensively used within the automotive and industrial power storage, with ongoing manufacturing capability enlargement.
JCET continues to reinforce its technological innovation, with R&D funding of RMB 1.08 billion within the first three quarters of 2023, a year-on-year improve of 10.4%. The corporate continues to advertise the development of high-performance packaging manufacturing capacities and improve current factories in the direction of superior packaging applied sciences. As well as, JCET improves lean manufacturing capabilities, strengthens stock management and provide chain administration, and ensures that the corporate’s operations stay extremely environment friendly.
Mr. Li ZhengCEO of JCET, stated, “Lately, JCET, by specializing in high-performance superior packaging applied sciences, has made breakthrough progress in collaboration with main prospects on the high-end chip enterprise and achieved important quarter-on-quarter progress in efficiency for the third quarter of this 12 months. The corporate will seize new alternatives arising from the restructuring of the worldwide industrial chain and can proceed to advertise the wholesome improvement of IC back-end manufacturing.”
Click on to view: JCET 2023 Third Quarter Report
About JCET Group
JCET Group is the world’s main integrated-circuit manufacturing and know-how providers supplier, providing a full vary of turnkey providers that embrace semiconductor package deal integration design and characterization, R&D, wafer probe, wafer bumping, package deal meeting, ultimate check and drop cargo to distributors world wide.
Our complete portfolio covers a large spectrum of semiconductor functions equivalent to cellular, communication, compute, shopper, automotive and business and so forth., by superior wafer degree packaging, 2.5D/3D, System-in-Packaging, and dependable flip chip and wire bonding applied sciences. JCET Group has two R&D facilities in China and Korea, six manufacturing areas in ChinaKorea and Singaporeand gross sales facilities world wide, offering shut know-how collaboration and environment friendly supply-chain manufacturing to prospects in China and world wide.
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SOURCE JCET Group
