
It’s aiming at energetic MIMO (a number of enter a number of output) antenna arrays, the place utilizing a top-side cooled amplifier (‘PA’ upside-down in diagram proper) permits all warmth to be extracted from one facet of a easy PCB, leaving its different facet accessible for the antennas.
The purpose is to chop the load of every enclosure required for the bottom station to underneath 23kg (20kg is the 2023 goal, mentioned NXP) to permit one particular person to carry and set up them. Lighter weight and decrease wind-induced loading additionally permits lighter supporting constructions for use.
Typical building utilizing its bottom-cooled amplifiers requires extra peak, mentioned NXP
The primary merchandise, accessible at present, are A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC – the latter will probably be supported by a improvement board sequence.
These mixed LDMOS and GaN applied sciences, and are geared toward 200W 32-transmit 32-receive (32T32R) radios masking 3.3 to three.8GHz, delivering 31dB acquire and 46% effectivity over 400MHz of instantaneous bandwidth, claimed NXP.

Spanning the tops of a number of sizzling top-side cooled packages brings with it the problem of compensating for package deal peak variation – on this case throughout 32 to 64 energy amplifiers and every other ICs on the RF PCB that want cooling.
How does the corporate suggest that designers take care of this?
“NXP recommends a niche filler sort thermal conductive materials,” NXP RF energy product supervisor Gavin Smith informed Electronics Weekly. “Typical hole distance needs to be saved to a minimal, and to not exceed 0.5mm based mostly on the thermal resistance vs thickness trade-off.”
This permits 0.1mm for package deal tolerance and 0.4mm for software tolerance.
And what sort of thermally-conductive materials?
“A excessive efficiency, low thermal resistance materials within the vary of 6 to 25W/mK, relying on the applying, is advisable”, replied Smith.
Is there a instructed half quantity for the thermally conductive compliant materials?
“NXP is engaged on figuring out just a few particular merchandise in the marketplace,” he mentioned. “Nonetheless, narrowing right down to just some will doubtless show tough as the tip purposes will range. We plan to have an app word to offer clients additional steering.”
On the tine of writing, no info on NXP’s three top-cooled RF amplifiers was accessible, however this hyperlink needs to be dwell by the point you, expensive reader, have entry to this text.
